CETC Silicon Carbide (SiC) Process Equipment
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Vacuum annealing furnace
- Introduction
- Feature
- Parameters
- Application scope
Vacuum annealing furnace is a heat treatment equipment combining vacuum technology and electric furnace heating technology. Because the equipment can provide a clean and impurity free high vacuum state, the heating temperature is uniform and can be accurately controlled, the process conditions are superior, the workpiece quality is excellent, and the yield is high.
- Beautiful appearance, small floor area.
With high precision and multi-function temperature controller, PID parameters can be adjusted and modified automatically, temperature control curve can be stored, modified, deleted and reset at any time, and the operation is simple and convenient.
It has many functions of fault display, alarm and interlock protection.
The furnace body can be pushed and pulled to accelerate the cooling of the low temperature section. 
- Applicable process sheet size: 2-6 inch round or square sheet
Common working temperature: 400-1100 ℃
Length and accuracy of constant temperature zone: ≤± 1 ℃ / 300mm (800-1100 ℃);
≤±1.5℃/300mm （400～800℃）
Maximum heating rate: 10 ℃ / min
Limit vacuum degree: ≤ 5 × 10-3pa;
Gas system: oxygen, nitrogen, argon, 2-way standby gas;
Automatic control: the whole process can be controlled by program. 
- It is used for sintering and annealing of semiconductor chips (film resistors, etc.), permanent magnet alloy manufacturing, vacuum brazing, vacuum degassing, non oxidation bright heat treatment of metal materials, etc.
ADVISORY MESSAGEA
