Magnetron sputtering coater
  • Magnetron sputtering coater
  • Magnetron sputtering coater
  • Magnetron sputtering coater

Magnetron sputtering coater

Adjustable target base distance
Sputtering angle adjustable
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  • Introduction
  • Feature
  • Parameters
  • Application scope
Magnetron sputtering equipment is a multi-functional, high efficiency coating equipment.Thin films of metal, nonmetal, oxide, medium and other materials can be sputtered on substrates such as ceramics, glass, quartz, silicon wafer, etc., such as Au, Al, NiCr, TiW, Si, Al2O3, Si3N4, ZnO, ITO, etc.The spray coating is uniform, compact and has strong adhesion. It can be applied to the preparation of new electronic materials, optics, solar energy, semiconductor and other fields. 详情
  • The sputtering target angle can be adjusted;
    There are two sputtering modes: single sputtering and co sputtering;
    It has many sputtering targets, and can deposit single-layer, multi-layer, alloy and doped films;
    The sputtering targets are isolated from each other to ensure that there is no mutual pollution between the targets;
    Sputtering mode: bottom-up sputtering, top-down sputtering optional;
    The substrate can be heated, and the single crystal film can be prepared by process control;
    The auxiliary cleaning ion source can be selected to effectively improve the adhesion of the film;
    Power configuration options: DC, RF, DC pulse, DC bias, RF bias;
    It has the characteristics of small target sputtering large substrate.
  • 特点
  • Applicable process sheet size: 2-6 inch round or square sheet
    Common working temperature: 400-1100 ℃
    Length and accuracy of constant temperature zone: ≤± 1 ℃ / 300mm (800-1100 ℃);
    ≤±1.5℃/300mm   (400~800℃)
    Maximum heating rate: 10 ℃ / min
    Limit vacuum degree: ≤ 5 × 10-3pa;
    Gas system: oxygen, nitrogen, argon, 2-way standby gas;
    Automatic control: the whole process can be controlled by program.
  • 参数
  • It is used for sintering and annealing of semiconductor chips (film resistors, etc.), permanent magnet alloy manufacturing, vacuum brazing, vacuum degassing, non oxidation bright heat treatment of metal materials, etc.
  • 范围
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