CETC Silicon Carbide (SiC) Process Equipment
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Cluster magnetron sputtering system
Automatic loading and unloading
Multi piece process
One key fully automatic process
Multi chamber structure, single target and single chamber independent technology
Patented circular cathode target, good film uniformity, high target utilization rate
Multi piece process
One key fully automatic process
Multi chamber structure, single target and single chamber independent technology
Patented circular cathode target, good film uniformity, high target utilization rate
- Introduction
- Feature
- Parameters
- Application scope
Magnetron sputtering equipment is a multi-functional, high efficiency coating equipment.Thin films of metal, nonmetal, oxide, medium and other materials can be sputtered on substrates such as ceramics, glass, quartz, silicon wafer, etc., such as Au, Al, NiCr, TiW, Si, Al2O3, Si3N4, ZnO, ITO, etc.The spray coating is uniform, compact and has strong adhesion. It can be applied to the preparation of new electronic materials, optics, solar energy, semiconductor and other fields.
- "Cluster tool" continuous online working mode;
With "target lifetime" recording function;
Sputtering layout: bottom-up sputtering, top-down sputtering optional;
Optional SMIF components;
It can be equipped with substrate table with high and low temperature control, suitable for special film preparation. 
- -Up to 6 cavities can be mounted
-Number of targets: 2-4
-Substrate size: 4-8 inches
-Uniformity of film thickness: ≤ 3%
-Film thickness repeatability: ≤ 5% 
- Various kinds of metal, nonmetal, compound and other thin film materials are plated on the surface of flat substrate.Such as Al, Cu, Au, Pt, Ti, Ni, W, NiCr, TiW, SiO2, Al2O3, TiO2, ZnO, Tan, ITO and other thin films.Suitable for mass production.
ADVISORY MESSAGEA
