CETC Silicon Carbide (SiC) Process Equipment
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Reactive ion etching machine
- Introduction
- Feature
- Parameters
- Application scope
Reactive ion etching (RIE) is a kind of dry etching equipment, which uses radio frequency discharge to ionize reaction gas to produce active ions, and uses active ions to combine with workpiece surface materials to generate volatile products, which are pumped away by vacuum pump, so as to achieve the removal of workpiece surface materials.Widely used in semiconductor devices, power electronic devices, optoelectronics, solar cells, micro machinery and other fields.
- ·Constant reaction pressure, automatic control, good process repeatability
·Process gas spray coupling, good etching uniformity
·Automatic control of technological process, simple and convenient operation 
- 1) Applicable chip size: 4 "～ 8";
2) Etching minimum linewidth: 1um
3) Uniformity: ± 5% (in tablets), ± 3% (between batches)
4) Substrate cooling: water cooling 
- It is used for polishing the substrate surface or material removal, especially for fast etching of non-metallic materials and oxide films, such as polysilicon, SiO2, Si3N4, etc.
ADVISORY MESSAGEA
